Rigid-Flex Board
8 Layer HDI Rigid-Flex PCB
Material
S1000-2M+ Polyimide（SY）
Layer
8L(2R+4F+2R)
Thickness
1.03mm 土10%
Min Track/spacing
0.076 / 0.1mm
Min hole size
0.10mm
Surface finish
Immersion gold(ENIG)
Special technology
2-Level HDI.Multi – Layered Laser Decapping.HI-POT
